These materials excel in dielectic properties and they are suitable for IC plastic package such as high frequency devices.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832MG | GHPL-830MG | 0.06, 0.1, 0.13 0.15, 0.18, 0.2, 0.25, 0.3, 0.35, 0.38, 0.4, 0.45, 0.5, 0.55, 0.6-0.8 (0.1step)mm | 0.04, 0.045, 0.05, 0.055, 0.065, 0.075, 0.09, 0.1, 0.17mm |
CCL-HL832MG / GHPL-830MG has low dielectric properties. It was developed to meet the needs of RF semiconductor subtrates.
Reviews BT Materials for High Speed IC Plastic Package
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