This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the following uses
Mode FM-6643 : 300mm(12 inch) semi-automatic wafer mounter
Mode FM-6648 : 200mm( 8 inch) semi-automatic wafer mounter
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Features
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User-settable parameters, including application pressure, speed, and temperature
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Variable application pitch for normal tape
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Tension-free application
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Bubble-free application
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Can be customized for non-contact surface application
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Equipped with measures against static electricity
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Compact, light-weight, and small-footprint type
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Uses
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For dicing process with both pre-cut and normal tape
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For dicing process with pre-cut tape only
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For dicing process with normal tape only
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For precut two-layered tape (DAF with dicing tape)
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For normal two-layered tape (DAF with dicing tape)
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For single DAF tape
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For back grind (BG) film
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For front-protection film
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For rear-protection film
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For functional film (resist film, CSP film sealings, underfill film, and others)
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Reviews FM-6643-DF | Semi -Auto | 300mm/12” | Single DAF tape
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