Semi-auto wafer mounter that mounts wafer onto dicing tape once the operator supplies The wafer and ring frame by hand.
Specification
| Application Wafer | 6'', 8'' or 8'', 12'' |
| Wafer Thickness | 200um <= (8") |
| 330um <= (12") | |
| Wafer Warpage | 4mm >= |
| Tape Wide | 300mm, 400mm |
| Application Tape | Normal and UV Tape |
| UPH | 45 wafer/hour(12"), 50 wafer/hour(8") |
| Main Controller | PLC |
| Data and GUI | PC |
| Blade Life Time | 10,000 sheets |
| Chuck Temperature | 80ºC +/- 5ºC |
| Tape Consumption | 30 ~ 40 mm |
| Wafer Angle | 0º, 90º, 180º, 270º |
Options
|
Facility
| Power Supply | AC220V +/-10% |
| Phase | Single |
| Frequency | 50/60 Hz |
| Amphere | 30A |
| Air Supply | 5.0Kgf/cm2 |
| Dimension for 12”, 8” machine | 2300x1600x1850(LxDxH) approx. 800kg |
| Dimension for 8”, 6” machine | 1050x1175x1850(LxDxH) approx. 850kg |
Reviews Semi Auto Wafer Mounter
Bạn chưa đánh giá sao cho sản phẩm này
Đánh giá ngay