LED AI Vision Inspection LV30SH

Product Code : LE1258
Availability: Đặt trước
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LV30SH

Inline vision equipment for testing defects in lead frame chips and wires in ring frames loaded into cassettes.

 

2D Vision Inspection

  • Rotation, movement, crack inspection after chip bonding
  • Bending, breaking, short inspection after wire bonding

Compact Design

  • 1684 (W) x 1800 (D) x 1764 (H) mm
  • 25 megapixel camera
  • 4.5μm telecentric lens
  • 8 layers light (UV)

3D Vision Inspection (LV50SH)

  • High speed-fixed density 3D laser sensor application

 

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