Wafer AI Vision Inspection WV30SS

The equipment moves the Wafer supplied from the loader to Vision Inspection Stage using Robot. After Side Chipping inspection, the inspection is performed at the customer level, and the results are saved as map files.

2D Vision Inspection

• Inspect wafer cracking, etching, align miss, warpage, scratch
• Side chipping inspection after wafer alignment

Compact design

• 2400 (W) x 1800 (D) x 1800 (H) mm
• 25 megapixel camera
• 4.5μm telecentric lens
• 7 layers + spot (coaxial)

3D Vision Inspection (WV50SH)

• High speed-fixed density 3D laser sensor application