Máy nối siêu âm kỹ thuật số Model 616B-003

Overview

Model 616B-003 Digital Ultrasonic Single Channel Peg Bonder is designed for ultrasonic bonding of interconnects in applications that do not require the bonder to feed wire.

Applications include "tacking" tuning ribbons, insulated wire bonding, flex on flex bonding, pin tab bonding, mesh bonding , and ball coining.

When fitted with a WP-280 and OP-75, the 616B-003 becomes a semiautomatic machine for medium to high volume production.

Standard Features

• Hybond Soft Touch energy system
• Independent Z-axis lever for bonding tool control
• Motorized vertical wire feed
• 1-1-2, 1-2-2 & 1-2-1 stitch capability
• 0.5 and 2 inch spool mounts
• Loop height control adjustment
• Front panel wire feed control for manual tail adjustment
• Swing-away wire clamp assembly
• Deep vertical access of 0.59" (1,49cm)
• Long horizontal reach of 6.5 in. (16,5cm)
• Deep access Wire-In-Tool 90° wire feed
• Wire and ribbon bonding capability
• Independent control of 1st & 2nd bond parameters
• Tail length adjustable in .003" increments
• Audio & visual bond sequence fault indicators
• 10x12 in. (25,4x30,3 cm) X-Y work platform
• LED display of work stage temperature
• Infinite angle microscope mounting
• Front panel ultrasonic test button

Optional Features

• Leica Stereo Zoom microscope (OP-06S6T)
• Nikon SMZ660 microscope (OP-06A)
• Dual fiber-optic illuminator (OP-08A)
• 240 VAC 50/60 Hz input wiring (OP-12)
• 8:1 X-Y Manipulator (OP-30)
• Tool heater with temperature controller (OP-31)
• Heated Ultrasonic Transducer (OP-83)
• High & low ultrasonic power (OP-44)
• 2.125" diameter heated workstage (WST-15A)
• 4" x 4" heated workstage (WST-19B)

Specifications

» Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
» Ultrasonic Power Range: 0-2 watt on Low setting, 0-4 watts on High setting
» Bond Time Range: 0 - 900 mSec
» Bond Force Range: 12 - 300 grams
» Bondable Wire Diameters: 0.5 to 2.0 mils (12,5 to 50 µm) insulated ; 0.5 to 2.0 mils (12,5 to 50 µm) bare
» Bondable Ribbon Dimensions: Up to 2 x 20 mils (50 x 500 µm)
» Bondable Wire /Ribbon Materials: Gold, gold plated copper and aluminium
» Bond Head Movement: True vertical motorized movement
» Bond Actuation: Sensor at variable height, actuated by contact with bond surface
» Z Axis Travel: 0.75 in (19 mm)
» Vertical Bonding Window: 0.75 inch (19 mm)
» Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
» Bond Head Dimensions: 13.4" x 6.75" x 6.75" (34cm x 17,2cm x 17,2cm)
» Control Unit Dimensions: 14" x 9.5" x 11.5" (35,6cm x 24,1cm x 29,2cm)
» Unit Weight /Shipping Weight: 37 / 130 lbs (16,8 / 59,1 Kg). Shipping weight will vary.
» Industry Standards: CE Certified