Model 616B-005 Thermosonic Peg Bonder

Overview

Model 616B-005 thermosonic single channel peg bonder has been designed to perform thermosonic attachment of insulated or bare wire / ribbon.
 
This unit contains a built-in in temperature controller.
 
Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.

Standard Features

• Hybond Soft Touch energy system
• Motorized Z axis control
• 1.5 inch vertical bonding window
• Variable height bonding within 1.5 inch
• Built-in temperature controller
• Search height adjustable in 0.001 inch increments
• 0-900 mSec bond time
• Wiring for 120 VAC 50/60Hz @ 10A Max.
• Optional Features
• Leica Stereo Zoom microscope (OP-06S6T)
• Nikon SMZ660 microscope (OP-06A)
• Dual fiber-optic illuminator (OP-08A)
• 240 VAC 50/60 Hz input wiring (OP-12)
• Bonder capability for vacuum pick & place (OP-47)
• 8:1 X-Y Manipulator (OP-30)
• Pick-up / Bond Tool (BLDBT-X) used with OP-47
• Peg Tool (PT-X.X)

Optional Features

• Leica Stereo Zoom microscope (OP-06S6T)
• Nikon SMZ660 microscope (OP-06A)
• Dual fiber-optic illuminator (OP-08A)
• 240 VAC 50/60 Hz input wiring (OP-12)
• Bonder capability for vacuum pick & place (OP-47)
• 8:1 X-Y Manipulator (OP-30)
• Pick-up / Bond Tool (BLDBT-X) used with OP-47
• Peg Tool (PT-X.X)