Tapes for semiconductor manufacturing process

【A】 Dicing Tape for Wafer

• We use UV release adhesive, which has less adhesive residue when stripping the tape.
• The use of a special UV peel-off pressure-sensitive adhesive makes it easy to peel off. When peeling off, the adhesive becomes weaker due to UV exposure.
• Special PO (Polyolefin) is used as the base film. It has isotropic elongation.
• The 10 substances regulated by the RoHS Directive are all below the regulatory values.

【B】 Dicing Tape for Package

• We use UV release adhesive, which has less adhesive residue when stripping the tape.
• The use of a special UV peel-off pressure-sensitive adhesive makes it easy to peel off. When peeling off, the adhesive becomes weaker due to UV exposure.
• Special PO (Polyolefin) is used as the base film. It has isotropic elongation.
• The 10 substances regulated by the RoHS Directive are all below the regulatory values.

【C】 Back grinding tape

• Highly traceable to irregularities such as bumps on the wafer surface, preventing dimples and wafer damage after backgrinding.
• PET base material is used to prevent wafer warpage.
• Bump height of 100µm or more (approx.-300µm) is also available.
• Two types are available: UV peeling type and pressure sensitive type.

Description of adhesion

Our adhesion test is based on JIS Z 0237(2022).

For comparison to the conventional method, the tested value by Sliontec Method is also described in the parenthesis.

Product List