Groove design suitable for processing of flexible multilayer board is excellent in balance between hole position quality and hole wall quality and realize high precision high speed drilling.
Unique groove design considering chip discharge and the drill rigidity realizes high breakage resistance and good hole position accuracy.
It's suitable for the stacks up processing of the multilayer board by the ultra-small diameter drill.
Unique groove design with varying helix angle realizes high hole inner wall quality and high breakage resistance with improved drill rigidity.
Suitable for ultra-small diameter drilling.
